Description
Infinity Bond EPH20E-SP Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H20E-SP is a two-component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material – LED, LCDs, and fiber optic components.
Infinity Bond EP H20E-SP is suggested for plastic IC packaging, high power devices, and high current flow, High power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping, or by hand.
Sizes Available
Premixedsyringes:Packaged in 3cc, 5cc, and 10cc disposable syringes.Syringes are shipped on dry ice at -80C.
Alternativeto EPO-TEKH20E
Infinity Bond EP H20E-SP is a directreplacement for EPO-TEKH20E epoxy adhesive. If you have questions about switching from EPO-TEKH20Eto Infinity Bond EP H20E-SP, don’t hesitate tocontact us.
Specifications
| Color | Silver |
| Specific Gravity | 2.6-2.7 |
| Hardness, Shore D | 75 |
| Lap Shear Strength to Aluminum, psi | 1600 |
| Volume Resistivity, ohm-cm | <0.0004 |
| Glass Transition Temperature (Tg), C | 100 |
| Thermal Conductivity, W/mK | 2.5 |
Reviews
There are no reviews yet.